Browsing Articles by imec author "d7def1b15f53a593f09366e363742982201d61cf"
Now showing items 1-7 of 7
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Area-Selective Electroless Deposition of Cu for Hybrid Bonding
Inoue, Fumihiro; Iacovo, Serena; El-Mekki, Zaid; Kim, Soon-Wook; Struyf, Herbert; Beyne, Eric (2021) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Armini, Silvia; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Demuynck, Steven (2013) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Radisic, Alex; Philipsen, Harold; Honore, Mia; Slabbekoorn, John; Struyf, Herbert; Arnold, Marco; Fluegel, Alexander; Mayer, Dieter; Shu-Ya Chang, Iris (2017) -
Impact of "terminal effect" on Cu electrochemical deposition: filling capability for different metallization options
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2011) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011) -
Wafer scale copper direct plating on thin PVD RuTa layers: A route to enable filling 30 nm features and below?
Armini, Silvia; El-Mekki, Zaid; Nagar, Margalit; Radisic, Alex; Vereecken, Philippe (2014)