Authors

Armini, Silvia; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Demuynck, Steven

ISSN

0013-4651

Issue

3

Journal

Journal of the Electrochemical Society

Volume

160

Title

Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments

Publication type

Journal article