Publication:
Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
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1929 since deposited on 2021-10-21
2last month
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Acq. date: 2025-12-10
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Views
1929 since deposited on 2021-10-21
2last month
2last week
Acq. date: 2025-12-10
Citations