Browsing Articles by author "La Manna, Antonio"
Now showing items 1-6 of 6
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3D
Zhang, Wenqi; Limaye, Paresh; La Manna, Antonio; Beyne, Eric; Soussan, Philippe (2011) -
Challenges in the packaging of GaN-on-si devices
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-03) -
Il packaging dei dispositivi GaN-on-Si
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-01) -
Measurements and analysis of substrate noise coupling in TSV based 3D integrated circuits
Araga, Yuuki; Nagata, Makoto; Van der Plas, Geert; Marchal, Pol; Libois, Michael; La Manna, Antonio; Zhang, Wenqi; Beyer, Gerald; Beyne, Eric (2014-06) -
Packaging von GaN-on-Si
La Manna, Antonio; Limaye, Paresh; Decoutere, Stefaan; Beyne, Eric (2011-09) -
Use of wafer applied underfill for 3D stacking
La Manna, Antonio; Rebibis, Kenneth June; Gerets, Carine; Beyne, Eric (2012)