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Characterisation of Cu surface cleaning by downstream N2/H2 plasma

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorShamiryan, Denis
dc.contributor.authorBeyer, Gerald
dc.contributor.authorConard, Thierry
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T16:36:42Z
dc.date.available2021-10-14T16:36:42Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5038
dc.sourceIIOimport
dc.titleCharacterisation of Cu surface cleaning by downstream N2/H2 plasma
dc.typeProceedings paper
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.source.peerreviewno
dc.source.beginpage153
dc.source.endpage159
dc.source.conferenceAdvanced Metallization Conference 2000
dc.source.conferencedate3/10/2000
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesConference Proceedings ULSI XVI


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