Publication:
Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers
Date
Loading...
Files
Journal
Abstract
Description
Statistics
Views
1890 since deposited on 2021-09-29
1last month
1last week
Acq. date: 2026-08-19
Citations
Statistics
Views
1890 since deposited on 2021-09-29
1last month
1last week
Acq. date: 2026-08-19
Citations