Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers
dc.contributor.author | Baumgart, H. | |
dc.contributor.author | Letavic, T. J. | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Maes, Herman | |
dc.contributor.author | Egloff, R. | |
dc.date.accessioned | 2021-09-29T13:04:12Z | |
dc.date.available | 2021-09-29T13:04:12Z | |
dc.date.issued | 1995 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/516 | |
dc.source | IIOimport | |
dc.title | Analysis of process-induced stresses in lateral trench isolation structures for high voltage devices in bonded SOI wafers | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 440 | |
dc.source.endpage | 54 | |
dc.source.conference | Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Physics and Applications | |
dc.source.conferencedate | 21/05/1995 | |
dc.source.conferencelocation | Reno, NV USA | |
imec.availability | Published - open access | |
imec.internalnotes | ECS Proceedings; Vol. 95-7 |