dc.contributor.author | Alves Donaton, Ricardo | |
dc.contributor.author | Coenegrachts, Bart | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Schaekers, Marc | |
dc.contributor.author | Sophie, Guus | |
dc.contributor.author | Matsuki, N. | |
dc.contributor.author | Baklanov, Mikhaïl | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Lepage, Muriel | |
dc.contributor.author | Vanhaelemeersch, Serge | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Stucchi, Michele | |
dc.contributor.author | De Roest, David | |
dc.contributor.author | Maex, Karen | |
dc.date.accessioned | 2021-10-14T16:52:32Z | |
dc.date.available | 2021-10-14T16:52:32Z | |
dc.date.issued | 2001 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5262 | |
dc.source | IIOimport | |
dc.title | Characterization and integration in Cu damascene structures of AURORA, an inorganic low-k dielectric | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Coenegrachts, Bart | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Schaekers, Marc | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Vanhaelemeersch, Serge | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Stucchi, Michele | |
dc.contributor.imecauthor | De Roest, David | |
dc.contributor.imecauthor | Maex, Karen | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Schaekers, Marc::0000-0002-1496-7816 | |
dc.contributor.orcidimec | Vanhaelemeersch, Serge::0000-0003-2102-7395 | |
dc.source.peerreview | no | |
dc.source.beginpage | D5.14.1 | |
dc.source.endpage | D5.14-6 | |
dc.source.conference | Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics | |
dc.source.conferencedate | 23/04/2000 | |
dc.source.conferencelocation | San Francisco, CA USA | |
imec.availability | Published - imec | |
imec.internalnotes | Materials Research Society Symposium Proceedings; Vol. 612 | |