Show simple item record

Non-contact post Cu CMP cleaning using megasonic energy

dc.contributor.authorFyen, Wim
dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorVos, Rita
dc.contributor.authorMeuris, Marc
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T16:57:12Z
dc.date.available2021-10-14T16:57:12Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5304
dc.sourceIIOimport
dc.titleNon-contact post Cu CMP cleaning using megasonic energy
dc.typeProceedings paper
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage39
dc.source.endpage42
dc.source.conferenceUltra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS
dc.source.conferencedate18/09/2000
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access
imec.internalnotesSolid State Phenomena. Part B; Vol. 76-77


Files in this item

Thumbnail
Name:
5308.pdf
Size:
301.2Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record