A quantitative study of the adhesion between copper, barrier and organic low-k polymers

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Authors
Lanckmans, Filip; Brongersma, Sywert; Varga, Istvan; Bender, Hugo; Beyne, Eric; Maex, Karen
Conference
Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics
Title
A quantitative study of the adhesion between copper, barrier and organic low-k polymers
Publication type
Proceedings paper
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