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A quantitative study of the adhesion between copper, barrier and organic low-k polymers

dc.contributor.authorLanckmans, Filip
dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVarga, Istvan
dc.contributor.authorBender, Hugo
dc.contributor.authorBeyne, Eric
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T17:13:18Z
dc.date.available2021-10-14T17:13:18Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5428
dc.sourceIIOimport
dc.titleA quantitative study of the adhesion between copper, barrier and organic low-k polymers
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpageD1.4.1
dc.source.endpageD1.4.6
dc.source.conferenceMaterials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics
dc.source.conferencedate23/04/2000
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec
imec.internalnotesMaterials Research Society Symposium Proceedings; Vol. 612


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