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Megasonic, non-contact cleaning followed by "Rotagoni" drying of CMP wafers

dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorMertens, Paul
dc.contributor.authorNicolosi, T.
dc.contributor.authorKenis, Karine
dc.contributor.authorFyen, Wim
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T17:13:43Z
dc.date.available2021-10-14T17:13:43Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5431
dc.sourceIIOimport
dc.titleMegasonic, non-contact cleaning followed by "Rotagoni" drying of CMP wafers
dc.typeProceedings paper
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorKenis, Karine
dc.contributor.imecauthorHeyns, Marc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage254
dc.source.endpage254
dc.source.conferenceUltra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS
dc.source.conferencedate18/09/2000
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access
imec.internalnotesSolid State Phenomena. Part B; Vol. 76-77


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