Authors

Palm, P.; Määttänen, J.; De Maquillé, Y.; Picault, A.; Vanfleteren, Jan; Vandecasteele, Bjorn

Conference

Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Polytronic

Title

Reliability of different flex materials in high density flip chip on flex applications

Publication type

Proceedings paper