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Reliability of different flex materials in high density flip chip on flex applications

dc.contributor.authorPalm, P.
dc.contributor.authorMäättänen, J.
dc.contributor.authorDe Maquillé, Y.
dc.contributor.authorPicault, A.
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorVandecasteele, Bjorn
dc.date.accessioned2021-10-14T17:33:24Z
dc.date.available2021-10-14T17:33:24Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5560
dc.sourceIIOimport
dc.titleReliability of different flex materials in high density flip chip on flex applications
dc.typeProceedings paper
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.source.peerreviewno
dc.source.beginpage224
dc.source.endpage229
dc.source.conferenceProceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Polytronic
dc.source.conferencedate21/10/2001
dc.source.conferencelocationPotsdam
imec.availabilityPublished - imec


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