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Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips

dc.contributor.authorThienpont, H.
dc.contributor.authorBaukens, V.
dc.contributor.authorVolckaerts, B.
dc.contributor.authorOttevaere, H.
dc.contributor.authorDebaes, C.
dc.contributor.authorVervaeke, M.
dc.contributor.authorTuteleers, P.
dc.contributor.authorVynck, P.
dc.contributor.authorHermanne, A.
dc.contributor.authorHanney, M.
dc.contributor.authorBrunfaut, Marnik
dc.contributor.authorVan Campenhout, Jan
dc.contributor.authorVeretennicoff, I.
dc.date.accessioned2021-10-14T17:58:34Z
dc.date.available2021-10-14T17:58:34Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5704
dc.sourceIIOimport
dc.titleLow-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
dc.typeProceedings paper
dc.source.peerreviewno
dc.source.beginpage6
dc.source.endpage18
dc.source.conferenceDesign, Test, Integration, and Packaging of MEMS/MOEMS
dc.source.conferencedate25/04/2001
dc.source.conferencelocationCannes France
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 4408


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