Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips

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Authors
Thienpont, H.; Baukens, V.; Volckaerts, B.; Ottevaere, H.; Debaes, C.; Vervaeke, M.; Tuteleers, P.; Vynck, P.; Hermanne, A.; Hanney, M.; Brunfaut, Marnik; Van Campenhout, Jan; Veretennicoff, I.
Conference
Design, Test, Integration, and Packaging of MEMS/MOEMS
Title
Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
Publication type
Proceedings paper
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