Publication:
Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips
Date
| dc.contributor.author | Thienpont, H. | |
| dc.contributor.author | Baukens, V. | |
| dc.contributor.author | Volckaerts, B. | |
| dc.contributor.author | Ottevaere, H. | |
| dc.contributor.author | Debaes, C. | |
| dc.contributor.author | Vervaeke, M. | |
| dc.contributor.author | Tuteleers, P. | |
| dc.contributor.author | Vynck, P. | |
| dc.contributor.author | Hermanne, A. | |
| dc.contributor.author | Hanney, M. | |
| dc.contributor.author | Brunfaut, Marnik | |
| dc.contributor.author | Van Campenhout, Jan | |
| dc.contributor.author | Veretennicoff, I. | |
| dc.date.accessioned | 2021-10-14T17:58:34Z | |
| dc.date.available | 2021-10-14T17:58:34Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5704 | |
| dc.source.beginpage | 6 | |
| dc.source.conference | Design, Test, Integration, and Packaging of MEMS/MOEMS | |
| dc.source.conferencedate | 25/04/2001 | |
| dc.source.conferencelocation | Cannes France | |
| dc.source.endpage | 18 | |
| dc.title | Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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