Publication:

Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips

Date

2001

Proceedings Paper

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Author(s)

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Brunfaut, Marnik

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Van Campenhout, Jan

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Veretennicoff, I.

Statistics

2016 since deposited on 2021-10-14

Acq. date: 2026-02-28