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Low-temperature 193nm resist reflow process for 100 nm generation contact patterning

dc.contributor.authorVan Driessche, Veerle
dc.contributor.authorLucas, Kevin
dc.contributor.authorVan Roey, Frieda
dc.contributor.authorGrozev, Grozdan
dc.contributor.authorTzviatkov, Plamen
dc.date.accessioned2021-10-14T18:03:31Z
dc.date.available2021-10-14T18:03:31Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5730
dc.sourceIIOimport
dc.titleLow-temperature 193nm resist reflow process for 100 nm generation contact patterning
dc.typeProceedings paper
dc.contributor.imecauthorVan Driessche, Veerle
dc.contributor.imecauthorVan Roey, Frieda
dc.contributor.imecauthorGrozev, Grozdan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage396
dc.source.endpage407
dc.source.conferenceLithography for Semiconductor Manufacturing II
dc.source.conferencedate30/05/2001
dc.source.conferencelocationEdinburgh UK
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 4404


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