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Theoretical and experimental quantitative characterization of the near-fields of printed circuit board interconnection structures

dc.contributor.authorCriel, Steven
dc.contributor.authorHaelvoet, Kurt
dc.contributor.authorMartens, Luc
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorFranchois, Ann
dc.contributor.authorDe Smedt, R.
dc.contributor.authorDe Langhe, Pascal
dc.date.accessioned2021-09-29T13:04:46Z
dc.date.available2021-09-29T13:04:46Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/573
dc.sourceIIOimport
dc.titleTheoretical and experimental quantitative characterization of the near-fields of printed circuit board interconnection structures
dc.typeProceedings paper
dc.contributor.imecauthorMartens, Luc
dc.contributor.imecauthorDe Zutter, Daniel
dc.source.peerreviewno
dc.source.beginpage471
dc.source.endpage474
dc.source.conferenceAtlanta 1995.EMC - a Global Concern. IEEE 1995 International Symposium on Electromagnetic Compatibility. Symposium Record; Augus
dc.source.conferencelocation
imec.availabilityPublished - imec


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