Show simple item record

Mechanical analysis of a SiLK/Cu dual damascene interconnect system

dc.contributor.authorWaeterloos, Joost
dc.contributor.authorShaffer, E.
dc.contributor.authorStokich, T.
dc.contributor.authorAlves Donaton, Ricardo
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T18:21:55Z
dc.date.available2021-10-14T18:21:55Z
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5825
dc.sourceIIOimport
dc.titleMechanical analysis of a SiLK/Cu dual damascene interconnect system
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.source.peerreviewno
dc.source.beginpage469
dc.source.endpage473
dc.source.conferenceAdvanced Metallization Conference 2000
dc.source.conferencedate3/10/2000
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesConference Proceedings ULSI XVI


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record