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Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps
Publication:
Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps
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Date
2025-01-01
Proceedings Paper
https://doi.org/10.1109/IRPS48204.2025.10982715
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Lesniewska, Alicja
;
Fang, Yu
;
Delie, Gilles
;
Roussel, Philippe
;
Van Sever, Koen
;
Chery, Emmanuel
;
Varela Pedreira, Olalla
;
Ciofi, Ivan
;
Park, Seongho
;
Tokei, Zsolt
;
Croes, Kristof
Journal
2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS
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8
since deposited on 2025-12-10
Acq. date: 2025-12-13
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Views
8
since deposited on 2025-12-10
Acq. date: 2025-12-13
Citations