Dynamic Flash Memory Operation Experimentally Validated with 65nm SOI Technology

Abstract

Dynamic Flash Memory (DFM) have been fabricated on 300 mm SOI wafers with 65 nm technology, experimentally validating a wide "1" and "0" margin for the first time. The proposed device operates exclusively with positive polarity signals, eliminating the need for negative voltages. Thanks to its unique split-gate structure, a long retention time of over 10 seconds at 85 ℃, and a robust Bit Line (BL) disturbance time of 10 ms with the BL stress voltage (VSBL) of 2.5 V are demonstrated.