2025 IEEE 75TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
Abstract
To cater for the demands for fine pitch applications TCB is being revamped to reach sub 20μ m pitch bonding. This however requires new packaging approaches as the standard way with flux dipping or non-conducting film (NCF) is not suitable for several reasons which are outlined in this work. The new TCB modes are presented together with results from actual sample builds. Literature explaining the mode of operation and chemical reactions of this new method is also outlined. We explore also Copper-Copper (Cu-Cu) solderless bonding and show some results as well as well as the factors which impact this mode of interconnect. We give an overview of what a bonder capable of such processes looks like and its key features as well as some data to backup the claims.
