Browsing Presentations by author "Radisic, Alex"
Now showing items 1-6 of 6
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Cu plating of through-Si vias for 3D-stacked integrated circuits
Radisic, Alex; Luhn, Ole; Swinnen, Bart; Bender, Hugo; Drijbooms, Chris; Doumen, Geert; Kellens, Kristof; Ruythooren, Wouter; Vereecken, Philippe (2008) -
Electrodeposition of interconnects for microelectronics and bio-medical applications
Radisic, Alex (2012) -
FIB/SEM structural analysis of through-silicon-vias
Bender, Hugo; Drijbooms, Chris; Radisic, Alex (2011) -
Impact of "terminal effect" on Cu plating: options and roadmap
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2010) -
Manganese dioxide coated 3D silicon pillars for lithium-ion battery applications
Etman, Ahmed; Radisic, Alex; Emara, Mahmoud; Huyghebaert, Cedric; Vereecken, Philippe (2012) -
"Terminal effect" on Cu electrochemical deposition: options and roadmap
Armini, Silvia; Tokei, Zsolt; Volders, Henny; El-Mekki, Zaid; Radisic, Alex; Beyer, Gerald; Ruythooren, Wouter; Vereecken, Philippe (2010)