Publication:
Cu plating of through-Si vias for 3D-stacked integrated circuits
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1990 since deposited on 2021-10-17
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Acq. date: 2025-10-25
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Metrics
Views
1990 since deposited on 2021-10-17
414item.page.metrics.field.last-week
Acq. date: 2025-10-25
Citations