Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Presentations
Cu plating of through-Si vias for 3D-stacked integrated circuits
Publication:
Cu plating of through-Si vias for 3D-stacked integrated circuits
Date
2008
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Radisic, Alex
;
Luhn, Ole
;
Swinnen, Bart
;
Bender, Hugo
;
Drijbooms, Chris
;
Doumen, Geert
;
Kellens, Kristof
;
Ruythooren, Wouter
;
Vereecken, Philippe
Journal
Abstract
Description
Metrics
Views
1990
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations
Metrics
Views
1990
since deposited on 2021-10-17
Acq. date: 2025-10-23
Citations