Browsing Presentations by imec author "247af4929b75543d804745c4cdcf40cb5bb1b30f"
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Advanced physical analysis of 3D interconnect
Ramachandran, Vidhya; Torregiani, Cristina; Dong Wook, Kim; Gu, Sam; Nowak, Matt; DiBattista, Michael; Babak, Motamedi; Civale, Yann; Redolfi, Augusto; Beyne, Eric; Croes, Kristof; Li, Yunlong; Routh, Bryan; Rue, Chad (2012) -
Barrier reliability on sub-100nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, T.; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, Bencherki; Maex, Karen (2004) -
Impact of line height on copper resistivity and interconnect RC delay: a geometry approach to reduce the size effect
Zhang, Wenqi; Brongersma, Sywert; Van Aelst, Joke; Richard, Olivier; Bamal, Mandeep; Heylen, Nancy; Li, Yunlong; Beyer, Gerald; Maex, Karen (2005) -
Monolithic Integration of Thin Film Photodiode with CMOS Technology for Infrared Imaging Applications
Li, Yunlong; Malinowski, Pawel; Georgitzikis, Epimitheas; Pejovic, Vladimir; Lee, Jiwon; Lim, Myung jin; Mao, Ming; Moreno Hagelsieb, Luis; Lieberman, Itai; Cheyns, David; Sabuncuoglu Tezcan, Deniz (2021-03) -
Process and properties of ALD tungsten nitride carbide barrier films for interconnects
Schuhmacher, Jörg; Tokei, Zsolt; Beyer, Gerald; Li, Yunlong; Stokhof, Maarten; Schaekers, Marc; Maex, Karen (2003)