Browsing Presentations by imec author "f0a01496634746fba1f211078ac4f6096403b3fd"
Now showing items 1-6 of 6
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Ingebedde chips in printkaarten: van idee tot industrialisering
Cauwe, Maarten (2011) -
Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
Jarboui, Ahmed; Cauwe, Maarten; Vermeiren, Filip; Verplancke, Rik; Hamadi, Khemakhem; Vanfleteren, Jan; Op de Beeck, Maaike (2013) -
Passive component embedding in printed circuit boards for space applications
Cauwe, Maarten; Schmid, Gerhard; De Cuyper, Steven; Lacombe, Denis (2016) -
Technology development for a flexible, low-cost backplane for lighting applications
Cauwe, Maarten; Sridhar, Ashok; Sterken, Tom (2014) -
Technology development for a flexible, low-cost backplane for lighting applications
Cauwe, Maarten; Sridhar, Ashok; Sterken, Tom (2014) -
Technology development for a low-cost, roll-to-chip embedding solution based on PET foils
Cauwe, Maarten (2011)