Recently added

Loss reduction and directional scattering in V-antennas

Vercruysse, Dries; Lagae, Liesbet; Van Dorpe, Pol; Sonnefraud, Yannick; Maier, Stefan (2013)

New approach for shock testing of lead-free soldered connections

Vandevelde, Bart; Willems, Geert (2013)

Reduced solder joint lifetime due to introduction of low- CTE (green) mould compounds

Vandevelde, Bart; Thijs, Steven; Willems, Geert (2013)

Recent packaging and board assembly challenges for high-reliabliity applications

Vandevelde, Bart (2013)

Chip package interaction

Vandevelde, Bart (2013)

Development od diamond-based biosensor for the detection of point mutations in PKU patients based on the heat-transfer resistance principle

Vanden Bon, Natalie; Van Grinsven, Bart; Vermeeeren, Veronique; Murib, Mohammed; Janssens, Stoffel; Haenen, Ken; Ameloot, Marcel; De Ceuninck, Ward; Wagner, Patrick; Michiels, Luc (2013)

Ultrafast DPSS laser interaction with thin-film barrier stacks

Van Steenberge, Geert; Fledderus, Henri; Hoegen, Thomas; Naithani, Sanjeev; Schaubroeck, David; Mandamparambil, Rajesh; Yakimets, Iryna (2013)

Optoelectronics packaging for efficient chip-to-waveguide coupling

Van Steenberge, Geert; Bosman, Erwin; Missinne, Jeroen; Van Hoe, Bram; Kaur, Kamalpreet; Kalathimekkad, Sandeep; Teigell Beneitez, Nuria; Elmogi, Ahmed (2013)

Low power and portable sensor systems for air monitoring

van Schaijk, Rob (2013)

Energy harvesting for self-powered sensor systems

van Schaijk, Rob (2013)

Energy harvesting

van Schaijk, Rob (2013)

Synthetic antiferromagnetic nanoparticles as contrast agents in MRI

Van Roosbroeck, Ruben; Stakenborg, Tim; Van Roy, Wim; Lagae, Liesbet; Lammertyn, Jeroen (2013)

High throughput grating qualification of directed self-assembly patterns using optical metrology

Van Look, Lieve; Rincon Delgadillo, Paulina; Lee, Yu-tsung; Pollentier, Ivan; Gronheid, Roel; Cao, Yi; Lin, Guanyang; Nealey, Paul F. (2013)

Photonic skins for pressure shear and strain sensing

Van Hoe, Bram; Missinne, Jeroen; Bosman, Erwin; Van Steenberge, Geert (2013)

Implementing heat transfer resistivity as a key element in a nanocrystalline diamond based single nucleotide polymorphism detection array

Van Grinsven, Bart; Bers, Karolien; Vandenryt, Thijs; Janssen, Wiebke; Geerets, Bram; Ameloot, Marcel; Haenen, Ken; De Ceuninck, Ward; Wagner, Patrick (2013)

Presentations: Recent submissions

Loss reduction and directional scattering in V-antennas

New approach for shock testing of lead-free soldered connections

Reduced solder joint lifetime due to introduction of low- CTE (green) mould compounds

Recent packaging and board assembly challenges for high-reliabliity applications

Chip package interaction

Development od diamond-based biosensor for the detection of point mutations in PKU patients based on the heat-transfer resistance principle

Ultrafast DPSS laser interaction with thin-film barrier stacks

Optoelectronics packaging for efficient chip-to-waveguide coupling

Low power and portable sensor systems for air monitoring

Energy harvesting for self-powered sensor systems

Energy harvesting

Synthetic antiferromagnetic nanoparticles as contrast agents in MRI

High throughput grating qualification of directed self-assembly patterns using optical metrology

Photonic skins for pressure shear and strain sensing

Implementing heat transfer resistivity as a key element in a nanocrystalline diamond based single nucleotide polymorphism detection array

Analog designer's playground beyond 20nm, is it Circuit Physics or Auto Place&Route?

Exploiting the limits of scaling, and beyond

Executive R&D Panel: A Conversation on the Future of Semiconductor Technology

Europe's sustainable innovation engine

The power of the new innovation model

Presentations: Recent submissions

Loss reduction and directional scattering in V-antennas ﻿

New approach for shock testing of lead-free soldered connections ﻿

Reduced solder joint lifetime due to introduction of low- CTE (green) mould compounds ﻿

Recent packaging and board assembly challenges for high-reliabliity applications ﻿

Chip package interaction ﻿

Development od diamond-based biosensor for the detection of point mutations in PKU patients based on the heat-transfer resistance principle ﻿

Ultrafast DPSS laser interaction with thin-film barrier stacks ﻿

Optoelectronics packaging for efficient chip-to-waveguide coupling ﻿

Low power and portable sensor systems for air monitoring ﻿

Energy harvesting for self-powered sensor systems ﻿

Energy harvesting ﻿

Synthetic antiferromagnetic nanoparticles as contrast agents in MRI ﻿

High throughput grating qualification of directed self-assembly patterns using optical metrology ﻿

Photonic skins for pressure shear and strain sensing ﻿

Implementing heat transfer resistivity as a key element in a nanocrystalline diamond based single nucleotide polymorphism detection array ﻿

Analog designer's playground beyond 20nm, is it Circuit Physics or Auto Place&Route? ﻿

Exploiting the limits of scaling, and beyond ﻿

Executive R&D Panel: A Conversation on the Future of Semiconductor Technology ﻿

Europe's sustainable innovation engine ﻿

The power of the new innovation model ﻿

Loss reduction and directional scattering in V-antennas

New approach for shock testing of lead-free soldered connections

Reduced solder joint lifetime due to introduction of low- CTE (green) mould compounds

Recent packaging and board assembly challenges for high-reliabliity applications

Chip package interaction

Development od diamond-based biosensor for the detection of point mutations in PKU patients based on the heat-transfer resistance principle

Ultrafast DPSS laser interaction with thin-film barrier stacks

Optoelectronics packaging for efficient chip-to-waveguide coupling

Low power and portable sensor systems for air monitoring

Energy harvesting for self-powered sensor systems

Energy harvesting

Synthetic antiferromagnetic nanoparticles as contrast agents in MRI

High throughput grating qualification of directed self-assembly patterns using optical metrology

Photonic skins for pressure shear and strain sensing

Implementing heat transfer resistivity as a key element in a nanocrystalline diamond based single nucleotide polymorphism detection array

Analog designer's playground beyond 20nm, is it Circuit Physics or Auto Place&Route?

Exploiting the limits of scaling, and beyond

Executive R&D Panel: A Conversation on the Future of Semiconductor Technology

Europe's sustainable innovation engine

The power of the new innovation model