ABSTRACT In this work, we demonstrate defect-free plating of Ø50 × 50 μm Cu pillars, on 300 mm wafers, for 3D stacking applications. We also demonstrate the capability to control and tune within-wafer (WIW) and within-die (WID) uniformity of Cu-pillar heights to given application requirements. Furthermore, by adjusting the concentration of plating additives, we are able to modify the shape and morphology of electroplated Cu pillars.
