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Grain structure evolution during annealing of electroplated copper

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorKerr, Emma
dc.contributor.authorVervoort, Iwan
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-14T21:11:41Z
dc.date.available2021-10-14T21:11:41Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6068
dc.sourceIIOimport
dc.titleGrain structure evolution during annealing of electroplated copper
dc.typeProceedings paper
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.source.peerreviewno
dc.source.beginpage229
dc.source.endpage234
dc.source.conferenceStress-Induced Phenomena in Metallization: 6th International Workshop
dc.source.conferencedate25/07/2001
dc.source.conferencelocationIthaca, NY USA
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Proceedings; Vol. 612


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