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Foundations for successful RF chip-package co-design: a packaging perspective

dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.date.accessioned2021-10-14T21:13:29Z
dc.date.available2021-10-14T21:13:29Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6096
dc.sourceIIOimport
dc.titleFoundations for successful RF chip-package co-design: a packaging perspective
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.conference10th URSI Forum
dc.source.conferencedate13/12/2002
dc.source.conferencelocationBrussels Belgium
imec.availabilityPublished - imec


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