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Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

dc.contributor.authorDegryse, Dominiek
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, M.
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-14T21:27:42Z
dc.date.available2021-10-14T21:27:42Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6246
dc.sourceIIOimport
dc.titleBond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage316
dc.source.endpage321
dc.source.conferenceProceedings of the 3rd Eurosime Conference
dc.source.conferencedate14/04/2002
dc.source.conferencelocationParis France
imec.availabilityPublished - imec


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