dc.contributor.author | Degryse, Dominiek | |
dc.contributor.author | Labie, Riet | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Gonzalez, M. | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-14T21:27:42Z | |
dc.date.available | 2021-10-14T21:27:42Z | |
dc.date.issued | 2002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6246 | |
dc.source | IIOimport | |
dc.title | Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Labie, Riet | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Labie, Riet::0000-0002-1401-1291 | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 316 | |
dc.source.endpage | 321 | |
dc.source.conference | Proceedings of the 3rd Eurosime Conference | |
dc.source.conferencedate | 14/04/2002 | |
dc.source.conferencelocation | Paris France | |
imec.availability | Published - imec | |