Show simple item record

Reduction of surface metallic contamination through optimized rinsing and single-wafer drying

dc.contributor.authorFyen, Wim
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorBearda, Twan
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-10-14T21:39:53Z
dc.date.available2021-10-14T21:39:53Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6340
dc.sourceIIOimport
dc.titleReduction of surface metallic contamination through optimized rinsing and single-wafer drying
dc.typeProceedings paper
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage91
dc.source.endpage101
dc.source.conferenceCleaning Technology in Semiconductor Device Manufacturing VII
dc.source.conferencedate4/09/2001
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesElectrochemical Society Proceedings; Vol. 2001-26


Files in this item

Thumbnail
Name:
6009.pdf
Size:
920.1Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record