Show simple item record

Dynamic compact thermal models for an ultra thin chip stacking technology

dc.contributor.authorPalacin, J.
dc.contributor.authorSalleras, M.
dc.contributor.authorMarco., S.
dc.contributor.authorMarty, A.
dc.contributor.authorTasselli, J.
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorBeyne, Eric
dc.contributor.authorVendier, O.
dc.contributor.authorCoella-Vera, A.
dc.date.accessioned2021-10-14T22:40:28Z
dc.date.available2021-10-14T22:40:28Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6685
dc.sourceIIOimport
dc.titleDynamic compact thermal models for an ultra thin chip stacking technology
dc.typeProceedings paper
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage93
dc.source.endpage100
dc.source.conferenceProceedings of the 3rd Eurosime Conference
dc.source.conferencedate14/04/2002
dc.source.conferencelocationParis France
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
6074.pdf
Size:
1.357Mb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record