Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding

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Authors
Ratchev, Petar; Carbonell, Laure; Ho, Meng; Bender, Hugo; De Wolf, Ingrid; Verlinden, B.
Conference
Proceedings 28th International Symposium for Testing and Failure Analysis - ISTFA
Title
Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Publication type
Proceedings paper
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