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Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding

dc.contributor.authorRatchev, Petar
dc.contributor.authorCarbonell, Laure
dc.contributor.authorHo, Meng
dc.contributor.authorBender, Hugo
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVerlinden, B.
dc.date.accessioned2021-10-14T22:54:30Z
dc.date.available2021-10-14T22:54:30Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6753
dc.sourceIIOimport
dc.titleOrientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
dc.typeProceedings paper
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage61
dc.source.endpage66
dc.source.conferenceProceedings 28th International Symposium for Testing and Failure Analysis - ISTFA
dc.source.conferencedate3/11/2002
dc.source.conferencelocationPhoenix, AZ USA
imec.availabilityPublished - imec


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