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Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
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Authors
Stoukatch, Serguei
;
Vaesen, Kristof
;
Ho, Meng
;
Beyne, Eric
Conference
Proceedings 52nd Electronic Components and Technology Conference
Title
Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
Publication type
Proceedings paper
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