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Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
Publication:
Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
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Date
2002
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Stoukatch, Serguei
;
Vaesen, Kristof
;
Ho, Meng
;
Beyne, Eric
Journal
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1859
since deposited on 2021-10-14
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Acq. date: 2025-12-09
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Metrics
Views
1859
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-09
Citations