dc.contributor.author | Stoukatch, Serguei | |
dc.contributor.author | Vaesen, Kristof | |
dc.contributor.author | Ho, Meng | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-14T23:16:14Z | |
dc.date.available | 2021-10-14T23:16:14Z | |
dc.date.issued | 2002 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6854 | |
dc.source | IIOimport | |
dc.title | Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vaesen, Kristof | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Vaesen, Kristof::0000-0001-9971-3593 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 1671 | |
dc.source.endpage | 1674 | |
dc.source.conference | Proceedings 52nd Electronic Components and Technology Conference | |
dc.source.conferencedate | 28/05/2002 | |
dc.source.conferencelocation | San Diego, CA USA | |
imec.availability | Published - imec | |