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Reliability of copper dual damascene influenced by pre-clean

dc.contributor.authorTokei, Zsolt
dc.contributor.authorLanckmans, Filip
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.contributor.authorBender, Hugo
dc.contributor.authorHens, S.
dc.contributor.authorVan Landuyt, J.
dc.date.accessioned2021-10-14T23:22:49Z
dc.date.available2021-10-14T23:22:49Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6885
dc.sourceIIOimport
dc.titleReliability of copper dual damascene influenced by pre-clean
dc.typeProceedings paper
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorMaex, Karen
dc.contributor.imecauthorBender, Hugo
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.source.peerreviewno
dc.source.beginpage118
dc.source.endpage123
dc.source.conferenceProceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate8/07/2002
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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