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100-nm generation contact patterning by low temperature 193-nm resist reflow process

dc.contributor.authorVan Driessche, Veerle
dc.contributor.authorLucas, Kevin
dc.contributor.authorVan Roey, Frieda
dc.contributor.authorGrozev, Grozdan
dc.contributor.authorTzviatkov, Plamen
dc.date.accessioned2021-10-14T23:33:53Z
dc.date.available2021-10-14T23:33:53Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6934
dc.sourceIIOimport
dc.title100-nm generation contact patterning by low temperature 193-nm resist reflow process
dc.typeProceedings paper
dc.contributor.imecauthorVan Driessche, Veerle
dc.contributor.imecauthorVan Roey, Frieda
dc.contributor.imecauthorGrozev, Grozdan
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage631
dc.source.endpage642
dc.source.conferenceAdvances in Resist Technology and Processing XIX
dc.source.conferencedate4/03/2002
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol.4690


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