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Influence of plating conditions on the dynamics of copper grain growth during thermal annealing
Publication:
Influence of plating conditions on the dynamics of copper grain growth during thermal annealing
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Date
2003
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brongersma, Sywert
;
D'Haen, Jan
;
Vanstreels, Kris
;
De Ceuninck, Ward
;
Maex, Karen
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1913
since deposited on 2021-10-15
Acq. date: 2025-12-18
Citations
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Views
1913
since deposited on 2021-10-15
Acq. date: 2025-12-18
Citations