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Influence of plating conditions on the dynamics of copper grain growth during thermal annealing

dc.contributor.authorBrongersma, Sywert
dc.contributor.authorD'Haen, Jan
dc.contributor.authorVanstreels, Kris
dc.contributor.authorDe Ceuninck, Ward
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-15T04:04:22Z
dc.date.available2021-10-15T04:04:22Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7260
dc.sourceIIOimport
dc.titleInfluence of plating conditions on the dynamics of copper grain growth during thermal annealing
dc.typeOral presentation
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorD'Haen, Jan
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorDe Ceuninck, Ward
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.source.peerreviewno
dc.source.conferenceMRS Spring Meeting Symposium E: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics
dc.source.conferencedate21/04/2003
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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