Publication:
Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
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1940 since deposited on 2021-10-15
1last month
Acq. date: 2026-01-09
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Metrics
Views
1940 since deposited on 2021-10-15
1last month
Acq. date: 2026-01-09
Citations