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Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
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Authors
Chandrasekhar, Arun
;
Stoukatch, Serguei
;
Brebels, Steven
;
Balachandran, Jayaprakash
;
Beyne, Eric
;
De Raedt, Walter
;
Nauwelaers, Bart
;
Podddar, Anindya
Conference
Proceedings 33rd European Microwave Conference
Title
Characterisation, modelling and design of bond-wire interconnects for chip-package co-design
Publication type
Proceedings paper
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