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Characterisation, modelling and design of bond-wire interconnects for chip-package co-design

dc.contributor.authorChandrasekhar, Arun
dc.contributor.authorStoukatch, Serguei
dc.contributor.authorBrebels, Steven
dc.contributor.authorBalachandran, Jayaprakash
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorPodddar, Anindya
dc.date.accessioned2021-10-15T04:07:55Z
dc.date.available2021-10-15T04:07:55Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7305
dc.sourceIIOimport
dc.titleCharacterisation, modelling and design of bond-wire interconnects for chip-package co-design
dc.typeProceedings paper
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage301
dc.source.endpage304
dc.source.conferenceProceedings 33rd European Microwave Conference
dc.source.conferencedate7/10/2003
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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