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Low temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding

dc.contributor.authorDe Moor, Piet
dc.contributor.authorBaert, Kris
dc.contributor.authorDu Bois, Bert
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorJourdain, Anne
dc.contributor.authorTilmans, Harrie
dc.contributor.authorVan De Peer, Myriam
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-15T04:22:17Z
dc.date.available2021-10-15T04:22:17Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7438
dc.sourceIIOimport
dc.titleLow temperature zero-level hermetic packaging for MEMS based on solder and polymer bonding
dc.typeMeeting abstract
dc.contributor.imecauthorDe Moor, Piet
dc.contributor.imecauthorDu Bois, Bert
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.imecauthorVan De Peer, Myriam
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecDu Bois, Bert::0000-0003-0147-1296
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conferenceIMAPS 5th Topical Technology Workshop on MEMS, Related Microsystems and Nanopackaging
dc.source.conferencedate20/11/2003
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec
imec.internalnotes


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