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An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration

dc.contributor.authorGonzalez, Mario
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVanden Bulcke, Mathieu
dc.contributor.authorWinters, Christophe
dc.contributor.authorBeyne, Eric
dc.contributor.authorLee, Y.J.
dc.contributor.authorHarkness, B.R.
dc.contributor.authorMohamed, M.
dc.contributor.authorMeynen, H.
dc.contributor.authorVanlathem, E.
dc.date.accessioned2021-10-15T04:48:41Z
dc.date.available2021-10-15T04:48:41Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7618
dc.sourceIIOimport
dc.titleAn analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVanden Bulcke, Mathieu
dc.contributor.imecauthorWinters, Christophe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.beginpage858
dc.source.endpage863
dc.source.conferenceProceedings of the 53rd Electronic Components and Technology Conference
dc.source.conferencedate27/05/2003
dc.source.conferencelocationNew Orleans, LA USA
imec.availabilityPublished - imec


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