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Important parameters influencing the rince efficiency of silicon wafers

dc.contributor.authorMeuris, Marc
dc.contributor.authorOpdebeeck, Ann
dc.contributor.authorCornelissen, Ingrid
dc.contributor.authorRotondaro, Antonio
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.date.accessioned2021-09-29T13:11:24Z
dc.date.available2021-09-29T13:11:24Z
dc.date.issued1995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/767
dc.sourceIIOimport
dc.titleImportant parameters influencing the rince efficiency of silicon wafers
dc.typeMeeting abstract
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorOpdebeeck, Ann
dc.contributor.imecauthorCornelissen, Ingrid
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage438
dc.source.conferenceElectrochemical Society Fall Meeting: 4th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
dc.source.conferencedate8/10/1995
dc.source.conferencelocationChicago, IL USA
imec.availabilityPublished - open access
imec.internalnotesECS Meeting Abstracts; Vol. 95-2


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