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Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment

dc.contributor.authorJonckheere, Rik
dc.contributor.authorPhilipsen, Vicky
dc.contributor.authorScheuring, Gerd
dc.contributor.authorHillman, Frank
dc.contributor.authorBrueck, Hans-Juergen
dc.contributor.authorOrdynskyy, Volodymyr
dc.contributor.authorPeter, Kai
dc.contributor.authorHourd, Andrew
dc.contributor.authorSchaetz, Thomas
dc.contributor.authorChen, Shiuh-Bin
dc.contributor.authorChen, Parkson
dc.contributor.authorSommer, Karl
dc.date.accessioned2021-10-15T05:04:05Z
dc.date.available2021-10-15T05:04:05Z
dc.date.issued2003-01
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7704
dc.sourceIIOimport
dc.titleThrough-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment
dc.typeProceedings paper
dc.contributor.imecauthorJonckheere, Rik
dc.contributor.imecauthorPhilipsen, Vicky
dc.contributor.orcidimecJonckheere, Rik::0000-0003-2211-9443
dc.contributor.orcidimecPhilipsen, Vicky::0000-0002-2959-432X
dc.source.peerreviewno
dc.source.beginpage158
dc.source.endpage168
dc.source.conference19th European Conference on Mask Technology for Integrated Circuits and Microcomponents
dc.source.conferencedate13/01/2003
dc.source.conferencelocationSonthofen Duitsland
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 5148


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